Effect of Cuso4 ⋅ 5H2O Concentration and Reaction Solution Temperature on the Uniformity of Cu Coating Prepared by Electroless Plating on Graphite Surface

Abstract

AbstractCopper plating on graphite surfaces is employed as an effective strategy to enhance the wettability between Cu and graphite, which is otherwise inadequate. To achieve a uniformly coated Cu layer on graphite surfaces, this study utilized rotational electroless plating. Subsequently, the effects of CuSO4 ⋅ 5H2O concentrations (10, 15, 20, and 25 g/L) and reaction solution temperatures (30, 40, 50, and 60 °C) on the uniformity and density of the Cu coating on the graphite surface were investigated. The findings reveal that variations in the concentration of the CuSO4 ⋅ 5H2O have a limited impact on the uniformity and densification of the Cu coating. Specifically, as the concentration of CuSO4 ⋅ 5H2O increases from 10 g/L to 25 g/L, there is a slight decrease in the uniformity and integrity of the Cu coating, with the density of Cu‐coated graphite powder decreasing marginally from 3.646 g/cm3 to 6.642 g/cm3. In contrast, the temperature of the reaction solution has a significant effect on the uniformity and densification of the Cu coating. With an increase in the reaction solution temperature from 30 °C to 60 °C, there is a noticeable deterioration in the uniformity and integrity of the Cu coating, with a decrease in the density of Cu‐coated graphite powder from 3.653 g/cm3 to 6.620 g/cm3.