Affiliation:
1. School of Materials and Energy University of Electronic Science and Technology of China No. 4, Section 2, Jianshe North Road 611731 Chengdu P. R. China
Abstract
AbstractThe variable dielectric properties of multilayer structural ceramic/polyolefin composite film substrate materials with silicon dioxide (SiO2) and titanium dioxide (TiO2) powders as fillers and 1,2‐polybutadiene/styrene‐butadiene‐styrene triblock copolymer/ethylene‐propylene‐diene terpolymer/(1,2‐PB/SBS/EPDM) as polymer matrix were systematically investigated. Single‐layer SiO2, TiO2 and SiO2/TiO2/polyolefin‐based composite films denoted as A, B and H, respectively, were prepared by the flow casting method, and then multilayer structural composite substrates with different stacking methods were prepared by the hot pressing method. Four different layering modes were used: ABAB, AABB, ABBA, and BAAB. It was found that the dielectric constants of all four modes were within the scientific range. Compared to the other four types of laminated substrates, however, the fifth composite substrate with four identical film laminations made from a blend of two fillers (HHHH) exhibited better thermal stability and had a lower dielectric loss (0.00206) at 10 GHz compared to the other four types of laminated substrates. On the other hand, the other four types of laminated substrates have better mechanical properties compared to the hybrid substrates. This work provides a new idea for the preparation of oxide ceramic/polyolefin‐based dielectric composites that meet the requirements of different dielectric and thermomechanical properties.