Affiliation:
1. Department of Chemistry and Life Sciences Institution Changchun University of Technology Changchun 130012 China
2. Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology Chinese Academy of Sciences Shenzhen 518103 China
3. Department of Nano Science and Technology Institute University of Science and Technology of China Suzhou 215123 China
Abstract
AbstractAs a typical organic phase change material, paraffin occupies the large phase‐transition latent heat, promising electronic insulation, excellent cycling and chemical stability as well as the low corrosivity, which is attractive in the thermal management. In the practical applications, the surface of paraffin should be protected by organic or inorganic layers to inhibit the leakage above the melting point. However, in the reported paraffin composites, the weak cycling stability and the low thermal conductivity restricts their applications. In this paper, the highly thermal conductive hexagonal boron nitride nanosheets (hBNNS) are used as the protective layer for wrapping the paraffin in a microemulsion method to form the hBN‐paraffin thermal management composite, which exhibits the large phase‐transition latent heat ~189 J g−1, the excellent cycling stability over 20 cycles and the high thermal conductivity ~1.2 W m−1 K−1. The developed paraffin@ hBN composite should be promising for the thermal management in electronic packing, and can be used to improve the reliability of electric devices.