Affiliation:
1. Jiangsu Province Key Laboratory of Environmentally Friendly Polymer Materials, Jiangsu Collaborative Innovation Center for Photovoltaic Science and Engineering School of Materials Science and Engineering, Changzhou University Changzhou 213164 China
2. Key Laboratory of Carbon Fiber and Functional Polymers(Beijing University of Chemical Technology)of Ministry of Education College of Materials Science and Engineering Beijing University of Chemical Technology Beijing 100029 China
3. Institute of Intelligent Flexible Mechatronics Jiangsu University Zhenjiang 212013 China
4. Yangzhou University Yangzhou 225009 China
Abstract
AbstractSelf‐healing poly(siloxane‐urethane) materials have garnered significant interest among researchers, owing to their superior resistance to high and low temperatures, solvents, corrosion, and biocompatibility. Nevertheless, most existing self‐healing poly(siloxane‐urethane) materials face challenges, including limited repair conditions and the challenge of balancing mechanical properties with repair efficiency. In this research, we introduced hydrogen bonds, metal coordination bonds, π–π bonds, and reversible ring structures into the poly(siloxane‐urethane) system through molecular chain structure design, successfully developing a multi‐dynamic cross‐linked poly(siloxane‐urethane) (PU‐Si), a development rarely reported in prior studies. This study examines the impact of varying amounts of hydroxyl‐terminated polydimethylsiloxane (PDMS‐OH) on the properties of PU‐Si. The results indicate that PU‐Si, regardless of the amount of PDMS‐OH added, can self‐healing under conditions of heating at 60 °C, and exposure to ultraviolet and infrared radiation. Specifically, when the PDMS‐OH addition reaches 1.0 g, the material exhibits superior mechanical properties and self‐healing efficiency, achieving a mechanical strength of 9.68 MPa and a self‐healing efficiency of 86.6 %. This material shows significant application potential in areas such as electronic skins, flexible sensors, and brain‐computer interfaces.