Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films-Reference-Cited by-同舟云学术

Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films

Published:2022-04-09 Issue:6 Volume:62 Page:1999-2007
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polymer Engineering & Sci

Author:

Gong Yutie¹,Li Zhenzhen¹,Li Hairong²,Wu Wenqi¹,Pei Xianglin³,Tu Junyang¹,Zhou Weijie¹,Jiang Ming¹^ORCID,Gong Wei³

Affiliation:

1. Key Laboratory of Textile Fiber and Products (Ministry of Education), School of Materials Science and Engineering Wuhan Textile University Wuhan People's Republic of China

2. Mechanical Metrology Division Hubei Institute of Measurement and Testing Technology Wuhan People's Republic of China

3. School of Materials and Architectural Engineering, Guizhou Normal University Guiyang People's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pen.25982

Reference25 articles.

1. Stimuli-responsive polymer as gate dielectric for organic transistor sensors

2. Stimuli-responsive materials in additive manufacturing

3. Stimuli-Induced Reversible Proton Transfer for Stimuli-Responsive Materials and Devices

4. Stimuli-responsive polydopamine-based smart materials

5. Dielectric switching studies of polyvinylidene fluoride thin films with dominant planar ferroelectric domain configuration for flexible electronic devices

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