Application of PARAFAC2 to fault detection and diagnosis in semiconductor etch

Author:

Wise Barry M.,Gallagher Neal B.,Martin Elaine B.

Publisher

Wiley

Subject

Applied Mathematics,Analytical Chemistry

Reference17 articles.

1. Detection of distorted pattern using dynamic time warping algorithm and application for supervision of bioprocesses. Prepr. IFAC Workshop on On-line Fault Detection and Supervision in the Chemical Process Industries, Newcastle, June 1995; 115-120.

2. Procedures for implementing sensor-based fault detection and classification (FDC) for advanced process control (APC). SEMATECH Tech Transfer Doc 97013235A-XFR, 1997.

3. Methodology for robust and sensitive fault detection. Electrochemical Society Meet., Montreal, May 1997; 97-9: 55-79.

4. A comparison of principal component analysis, multiway principal component analysis, trilinear decomposition and parallel factor analysis for fault detection in a semiconductor etch process

5. Modelling and diagnostics of batch processes and analogous kinetic experiments

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