Formation of a tetragonal Cu3Au alloy at gold/copper interfaces-Reference-Cited by-同舟云学术

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Formation of a tetragonal Cu3Au alloy at gold/copper interfaces

Published:2003 Issue:10 Volume:35 Page:793-798
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Sarkar Subhendu,Datta Alokmay,Chakraborty Purushottam,Satpati Biswarup

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference27 articles.

1. An Advanced History of India. Macmillan: London, 1956.

2. Crystal Structures, vol. 1. Interscience Publishing: New York, 1963.

3. X‐ray study of interdiffusion in bimetallic Cu–Au films

4. Preparation and characterization of epitaxial gold films deposited on mica by direct current magnetron sputtering

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultra-high depth resolution SIMS for the interface analysis of complex low-dimensional structures;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2008-04

2. FORMATION OF NOVEL Cu3Au ALLOY PHASE UNDER CONFINEMENT;International Journal of Nanoscience;2005-10

3. Interface-dominated growth of a metastable novel alloy phase;Journal of Materials Research;2005-10

4. Atomic spectrometry update. Atomic mass spectrometry;Journal of Analytical Atomic Spectrometry;2004

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