Low‐Defect Quantum Dot Lasers Directly Grown on Silicon Exhibiting Low Threshold Current and High Output Power at Elevated Temperatures

Author:

Papatryfonos Konstantinos12ORCID,Girard Jean‐Christophe2ORCID,Tang Mingchu1ORCID,Deng Huiwen1,Seeds Alwyn J.1,David Christophe2,Rodary Guillemin2,Liu Huiyun1,Selviah David R.1ORCID

Affiliation:

1. Department of Electronic and Electrical Engineering University College London London WC1E 7JE UK

2. Université Paris‐Saclay CNRS, Centre de Nanosciences et de Nanotechnologies Palaiseau 91120 France

Abstract

The direct growth of III‐V materials on silicon is a key enabler for developing monolithically integrated lasers, offering substantial potential for ultradense photonic integration in vital communications and computing technologies. However, the III‐V/Si lattice and thermal expansion mismatch pose significant hurdles, leading to defects that degrade lasing performance. This study overcomes this challenge, demonstrating InAs/GaAs‐on‐Si lasers that perform on par with top‐tier lasers on native GaAs substrates. This is achieved through a newly developed epitaxial approach comprising a series of rigorously optimized growth strategies. Atomic‐resolution scanning tunneling microscopy and spectroscopy experiments reveal exceptional material quality in the active region and elucidate the impact of each growth strategy on defect dynamics. The optimized III‐V‐on‐silicon ridge‐waveguide lasers demonstrate a continuous‐wave threshold current as low as 6 mA and high‐temperature operation reaching 165 °C. At 80 °C, critical for data center applications, they maintain a 12 mA threshold and 35 mW output power. Furthermore, lasers fabricated on both Si and GaAs substrates using identical processes exhibit virtually identical average threshold current. By eliminating the performance limitations associated with the GaAs/Si mismatch, this study paves the way for robust and high‐density integration of a broad spectrum of critical III‐V photonic technologies into the silicon ecosystem.

Funder

Horizon 2020 Framework Programme

Engineering and Physical Sciences Research Council

Publisher

Wiley

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