Nanowelding in Whole‐Lifetime Bottom‐Up Manufacturing: From Assembly to Service

Author:

Li Peifeng1,Kang Zhuo23,Rao Feng1,Lu Yang45,Zhang Yue23ORCID

Affiliation:

1. College of Materials Science and Engineering Shenzhen University Shenzhen 518060 P. R. China

2. Beijing Advanced Innovation Center for Materials Genome Engineering Beijing Key Laboratory for Advanced Energy Materials and Technologies University of Science and Technology Beijing Beijing 100083 P. R. China

3. State Key Laboratory for Advanced Metals and Materials School of Materials Science and Engineering University of Science and Technology Beijing Beijing 100083 P. R. China

4. Department of Mechanical Engineering City University of Hong Kong Kowloon Hong Kong 999077 P. R. China

5. Nanomanufacturing Laboratory (NML) Shenzhen Research Institute City University of Hong Kong Shenzhen 518057 P. R. China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Overseas Expertise Introduction Project for Discipline Innovation

Publisher

Wiley

Subject

General Materials Science,General Chemistry

Reference202 articles.

1. C. C.Lee C. J.Wang J. S.Kim 57th Electronic Components and Technology Conf. Proc.2007 p.648.

2. Contact Adhesion of Thin Gold Films on Elastomeric Supports: Cold Welding Under Ambient Conditions

3. Cold welding of ultrathin gold nanowires

4. Y.Zhou Elsevier Amsterdam2008 545.

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