Scanning Probe Microscopies for Characterizations of 2D Materials

Author:

Su Shaoqiang1,Zhao Jiong23,Ly Thuc Hue145ORCID

Affiliation:

1. Department of Chemistry and Center of Super‐Diamond & Advanced Films (COSDAF) City University of Hong Kong Kowloon 999077 China

2. Department of Applied Physics The Hong Kong Polytechnic University Kowloon Hong Kong 999077 P. R. China

3. The Hong Kong Polytechnic University Shenzhen Research Institute Shenzhen 518057 China

4. Department of Chemistry and State Key Laboratory of Marine Pollution City University of Hong Kong Hong Kong 999077 China

5. City University of Hong Kong Shenzhen Research Institute Shenzhen 518057 China

Abstract

Abstract2D materials are intriguing due to their remarkably thin and flat structure. This unique configuration allows the majority of their constituent atoms to be accessible on the surface, facilitating easier electron tunneling while generating weak surface forces. To decipher the subtle signals inherent in these materials, the application of techniques that offer atomic resolution (horizontal) and sub‐Angstrom (z‐height vertical) sensitivity is crucial. Scanning probe microscopy (SPM) emerges as the quintessential tool in this regard, owing to its atomic‐level spatial precision, ability to detect unitary charges, responsiveness to pico‐newton‐scale forces, and capability to discern pico‐ampere currents. Furthermore, the versatility of SPM to operate under varying environmental conditions, such as different temperatures and in the presence of various gases or liquids, opens up the possibility of studying the stability and reactivity of 2D materials in situ. The characteristic flatness, surface accessibility, ultra‐thinness, and weak signal strengths of 2D materials align perfectly with the capabilities of SPM technologies, enabling researchers to uncover the nuanced behaviors and properties of these advanced materials at the nanoscale and even the atomic scale.

Funder

National Natural Science Foundation of China

Environment and Conservation Fund

City University of Hong Kong

Hong Kong Polytechnic University

Publisher

Wiley

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