Fabrication and characterization of hexagonal boron nitride/polyester composites to study the effect of filler loading and surface modification for microelectronic applications

Abstract

AbstractThis work investigates a composite prepared with polyester and hexagonal boron nitride (hBN) in terms of the properties required in the material for microelectronics applications. The influence of filler loading and the surface treatment of hBN with a silane coupling agent (γ‐aminopropyl triethoxy silane) is studied. It has been observed that the silane‐modified hBN improves the compatibility and adhesion with the matrix as verified by SEM images. The experimental investigation reveals that the addition of hBN in polyester unwillingly rises the density, voids content, and water absorption rate. Though, the increment is limited with surface‐modified hBN. The material's mechanical properties improve with filler loading over a particular range of filler loading. The material's thermal conductivity and glass transition temperature increase with hBN content, whereas the coefficient of thermal expansion reduces. Polyester when filled with 40 wt% of the silane‐hBN, the thermal conductivity improves around six times that of unfilled polyester. The dielectric properties are marginally augmented with filler loading whereas, the increase in frequency results in the reduction of dielectric properties. It can be observed from the overall experimental analysis that the developed material can be used in different microelectronic applications.Highlights A new class of composite is developed with polyester and raw/modified hBN. Composite with modified hBN shows improved physical/mechanical properties. Thermal properties of polyester improved appreciably with treated hBN. The dielectric properties of composites remain well within the range. The fabricated composites are recommended for microelectronics applications.