Photoembossing of Periodic Relief Structures Using Polymerization- Induced Diffusion: A Combinatorial Study-Reference-Cited by-同舟云学术

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Photoembossing of Periodic Relief Structures Using Polymerization- Induced Diffusion: A Combinatorial Study

Published:2005-11-04 Issue:21 Volume:17 Page:2567-2571
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Sánchez C.,de Gans B.-J.,Kozodaev D.,Alexeev A.,Escuti M. J.,van Heesch C.,Bel T.,Schubert U. S.,Bastiaansen C. W. M.,Broer D. J.

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference16 articles.

1. A simple soft lithographic route to fabrication of poly(ethylene glycol) microstructures for protein and cell patterning

2. Self-Aligned, Vertical-Channel, Polymer Field-Effect Transistors

3. Micropatterning of Organic Electronic Devices by Cold-Welding

4. Reconfigurable diffraction gratings based on elastomeric microfluidic devices

5. Solid-State Replication of Relief Structures in Semicrystalline Polymers

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