Optimum temperature profile for noncatalytic reaction to produce polyamide hot melt adhesives
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference13 articles.
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Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Lower purity dimer acid based polyamides used as hot melt adhesives: synthesis and properties;Journal of Adhesion Science and Technology;2015-01-20
2. Effect of Temperature and Catalyst Concentrations on the Thermal Properties of Polyamide Adhesives at Low Operating Pressure;Chemical Product and Process Modeling;2010-09-21
3. Effect of reaction temperature on conversion and thermal properties of polyamide hot-melt adhesives;Asia-Pacific Journal of Chemical Engineering;2007
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