Encapsulation and backsheet adhesion metrology for photovoltaic modules-Reference-Cited by-同舟云学术

Encapsulation and backsheet adhesion metrology for photovoltaic modules

Published:2016-09-26 Issue:1 Volume:25 Page:87-96
ISSN:1062-7995
Container-title:Progress in Photovoltaics: Research and Applications
language:en
Short-container-title:Prog. Photovolt: Res. Appl.

Author:

Tracy Jared¹,Bosco Nick²,Novoa Fernando¹,Dauskardt Reinhold¹

Affiliation:

1. Department of Materials Science and Engineering Stanford University Stanford CA USA

2. National Renewable Energy Laboratory Golden CO USA

Funder

U.S. Department of Energy

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pip.2817

Reference39 articles.

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2. Long Term Reliability of Photovoltaic Modules

3. Adhesion strength study of EVA encapsulants on glass substrates;Pern FJ;National Center for Photovoltaics and Solar Program Review Meeting,2003

4. Moisture transport, adhesion, and corrosion protection of PV module packaging materials

5. ISO 8510‐1 adhesives—peel test for a flexible‐bonded‐to‐rigid test specimen assembly—part 1: 90 degree peel International Electrotechnical Commission1990;1‐6 Geneva.

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