Silicon‐containing fluorenylacetylene resins with low curing temperature and high thermal stability-Reference-Cited by-同舟云学术

Silicon‐containing fluorenylacetylene resins with low curing temperature and high thermal stability

Published:2019-07-22 Issue:48 Volume:136 Page:48262
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Lu Liewei¹,Guo Kangkang¹²,Zhu Junli³,Wang Fan¹,Zhu Yaping¹,Qi Huimin¹^ORCID

Affiliation:

1. Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and EngineeringEast China University of Science and Technology Shanghai 200237 China

2. Shanghai Electric Tools Research Institute Shanghai 200233 China

3. Shanghai Key Laboratory of Advanced Polymeric MaterialsEast China University of Science and Technology Shanghai 200237 China

Funder

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.48262

Reference34 articles.

1. A Novel Synthesis and Extremely High Thermal Stability of Poly[(phenylsilylene)ethynylene-1,3-phenyleneethynylene]

2. New Highly Heat-Resistant Polymers Containing Silicon: Poly(silyleneethynylenephenyleneethynylene)s

3. Organisation and reactivity of silicon-based hybrid materials with various cross-linking levels

4. Structural Study of Silyl−Carborane Hybrid Diethynylbenzene−Silylene Polymers by High-Resolution Solid-State 11B, 13C, and 29Si NMR Spectroscopy

5. Linear Ferrocenylene−Siloxyl−Diacetylene Polymers and Their Conversion to Ceramics with High Thermal and Oxidative Stabilities

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