Affiliation:
1. Department of Electronic and Electrical Engineering Dankook University 152, Jukjeon-ro, Suji-gu Yongin-si Gyeonggi-do Korea 16890
2. Dankook University 152, Jukjeon-ro, Suji-gu Yongin-si Gyeonggi-do Korea 16890
Abstract
As a result of reviewing the solder balls used to join between semiconductor display wiring, there were existing electrical characteristics and wettability vulnerabilities. To improve these problems, we considered indium and aluminum to make solder balls. Also, by analyzing the microstructure of solder balls, we were able to know the components and amounts of intermetallic compounds. As the amount of Al‐In intermetallic compounds increased, electrical conductivity, hardness, and wettability improved. The new Sotheball is applicable to highly integrated display panels and semiconductor packages and is expected to be widely used as a next‐generation semiconductor and display material.
Reference2 articles.
1. A study on the method of predicting reliable vulnerable parts in electronic boards in vibration environments;Prince S.Y. Lee;Korean Society of Mechanical Studies Papers Book A,2022
2. Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect