Analysis the microscopic solid-based wear process in the chemical mechanical planarization

Author:

Han Xuesong1,Gan Yong X.2

Affiliation:

1. School of Mechanical Engineering; Tianjin University; Tianjin 300072 China

2. Department of Mechanical, Industrial and Manufacturing Engineering; University of Toledo; Toledo OH 43606 USA

Funder

Doctoral Program of Higher Education of the Ministry of Education of China

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference21 articles.

1. The theory and design of plate glass polishing machine;Preston;J. Soc. Glass. Tech.,1927

2. Modeling of the removal rate in chemical mechanical polishing;Nguyen;Proc. SPIE Int. Soc. Opt. Eng.,2000

3. A plasticity-based model of material removal in chemical-mechanical polishing (CMP);Fu;IEEE Trans. Semicond. Manuf.,2001

4. Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification;Luo;IEEE Trans. Semicond. Manuf.,2003

5. Modeling tool for chemical-mechanical polishing design and evaluation;Runnels;IEEE Trans. Semicond. Manuf.,1998

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