P-11: Development of Easy-debonding IGZO TFT Array on Flexible PI Substrate at Low Temperature-Reference-Cited by-同舟云学术

P-11: Development of Easy-debonding IGZO TFT Array on Flexible PI Substrate at Low Temperature

Published:2014-06 Issue:1 Volume:45 Page:983-985
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:SID Symposium Digest of Technical Papers

Author:

Li Xi-Feng¹,Zhu Le-Yong¹,Chen Long-Long¹,Shi Ji-Feng¹,Sun Xiang¹,Zhang Jian-Hua¹,Xin En-Long¹,Chen Cheng-Chung²,Zang Hao-Chun²,Huo Si-Tao²,Ling Zhi-Hua²,Ma Jun²

Affiliation:

1. Shanghai University; No 149, Yanchang Rd Shanghai China

2. TIANMA MICRO-ELECTRONICS GROUP; 889 Huiqing RD., Pudong New District Shanghai China 201201

Publisher

Wiley

Reference5 articles.

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2. “Integration of organic LEDs and amorphous Si TFTs onto flexible and lightweight metal foil substrates,”;Wu;IEEE Electron Device Lett.,1997

3. “Ultra-thin flexible glass substrates,”;Plichta;Mater. Res. Soc. Symp.,2003

4. “Stress control for overlay registration in a-Si:H TFTs on flexible organicpolymer-foil substrates,”;Cheng;J. Soc. Inf. Display,2005

5. T. Afentakis M. Hatalis T. Voutsas J. Hartzell “High performance polysilicon circuits on thin metal foils,” 122 126 2003

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