A mechanically Robust, Damping, and High‐Temperature Tolerant Ion‐Conductive Elastomer for Noise‐Free Flexible Electronics

Author:

Shen Shengtao1,Du Zehang1,Zhou Piaopiao2,Zou Zhigang134,Lyu Xiaolin14ORCID

Affiliation:

1. Key Laboratory of Advanced Materials Technologies International (HongKong Macao and Taiwan) Joint Laboratory on Advanced Materials Technologies College of Materials Science and Engineering Fuzhou University Fuzhou Fujian 350108 China

2. Department of Critical Care Medicine Fujian Medical University Union Hospital Fuzhou Fujian 350108 China

3. Eco‐materials and Renewable Energy Research Center College of Engineering and Applied Sciences Nanjing University Nanjing 210093 China

4. Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China Fuzhou Fujian 350108 China

Abstract

AbstractIon‐conductive elastomers capable of damping can significantly mitigate the interference caused by mechanical noise during data acquisition in wearable and biomedical devices. However, currently available damping elastomers often lack robust mechanical properties and have a narrow temperature range for effective damping. Here, precise modulation of weak to strong ion‐dipole interactions plays a crucial role in bolstering network stability and tuning the relaxation behavior of supramolecular ion‐conductive elastomers (SICEs). The SICEs exhibit impressive mechanical properties, including a modulus of 13.2 MPa, a toughness of 65.6 MJ m−3, and a fracture energy of 74.9 kJ m−2. Additionally, they demonstrate remarkable damping capabilities, with a damping capacity of 91.2% and a peak tan δ of 1.11. Furthermore, the entropy‐driven rearrangement of ion‐dipole interactions ensures the damping properties of the SICE remain stable even at elevated temperatures (18–200 °C, with tan δ > 0.3), making it the most thermally resistant damping elastomer reported to date. Moreover, the SICE proves effective in filtering out various noises during physiological signal detection and strain sensing, highlighting its vast potential in flexible electronics.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Natural Science Foundation of Fujian Province

Publisher

Wiley

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