Multifunctional Materials Strategies for Enhanced Safety of Wireless, Skin‐Interfaced Bioelectronic Devices

Author:

Liu Claire12ORCID,Kim Jin‐Tae1,Yang Da Som1,Cho Donghwi13,Yoo Seonggwang1,Madhvapathy Surabhi R.14,Jeong Hyoyoung15,Yang Tianyu1,Luan Haiwen1,Avila Raudel6,Park Jihun1,Wu Yunyun1,Bryant Kennedy1,Cho Min17,Lee JiYong89,Kwak Jay Young16,Ryu WonHyoung8,Huang Yonggang14610ORCID,Nuzzo Ralph G.1112ORCID,Rogers John A.124613ORCID

Affiliation:

1. Querrey Simpson Institute for Bioelectronics Northwestern University Evanston IL 60208 USA

2. Department of Biomedical Engineering Northwestern University Evanston IL 60208 USA

3. Advanced Materials Division Korea Research Institute of Chemical Technology Yuseong‐gu Daejeon 34114 Republic of Korea

4. Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

5. Department of Electrical and Computer Engineering University of California Davis Davis CA 95616 USA

6. Department of Mechanical Engineering Northwestern University Evanston IL 60208 USA

7. Department of Chemical and Biomolecular Engineering University of Illinois Urbana‐Champaign Urbana IL 61801 USA

8. School of Mechanical Engineering Yonsei University Seoul 03722 Republic of Korea

9. Department of Mechanical Engineering University of Minnesota Twin Cities Minneapolis MN 55455 USA

10. Department of Civil and Environmental Engineering Northwestern University Evanston IL 60208 USA

11. Department of Chemistry University of Illinois Urbana‐Champaign Urbana IL 61801 USA

12. Division of Surface and Corrosion Science KTH Royal Institute of Technology Drottning Kristinasväg 51 Stockholm 10044 Sweden

13. Department of Electrical and Computer Engineering Northwestern University Evanston IL 60208 USA

Abstract

AbstractMany recently developed classes of wireless, skin‐interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self‐healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain‐adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin‐interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices.

Funder

National Science Foundation

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

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