Formation and Shape Changing of Conductive Helical Ribbons via Deposition of Highly Stressed Films on Mechanically Responsive Substrates
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Published:2023-12-18
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Volume:
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ISSN:1616-301X
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Container-title:Advanced Functional Materials
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language:en
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Short-container-title:Adv Funct Materials
Author:
Chaudhary Anjali1ORCID,
Prakash Divya J.2,
Jacobson RB1,
Lagally Max G.1,
Cavallo Francesca23ORCID
Affiliation:
1. Department of Materials Science and Engineering University of Wisconsin‐Madison Madison WI 53706 USA
2. Center for High‐Technology Materials 87106 University of New Mexico Albuquerque NM 87113 USA
3. Department of Electrical and Computer Engineering University of New Mexico Albuquerque NM 87113 USA
Abstract
AbstractThis work demonstrates that the electrodeposition of highly stressed films on compliant ribbons is a robust process to obtain helical structures with excellent mechanical stability and potentially high thermal and electrical conductance. Electrodeposition on end‐tethered ribbons alters their axial and bending stiffness while imparting mechanical stress to drive the formation of a helix with a microscale diameter and pitch in a controlled and scalable manner. The process generates helices with diameters and pitches between 80 and 200 µm and lengths as large as several millimeters. The approach is amenable to parallel processing a large number of 3D structures on any substrate, including large‐area semiconductor wafers. This phenomenon is explained in terms of the change of stress gradients as material is added. Applications of the fabricated helices include antennas, metamaterials, and slow‐wave structures in frequency ranges not previously attainable.
Funder
Center for Integrated Nanotechnologies
U.S. Department of Energy
Sandia National Laboratories
Subject
Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials