Alternative Metallic Fillers for the Preparation of Conductive Nanoinks for Sustainable Electronics

Author:

Corrales‐Pérez Belén1,Díaz‐Ufano Carlos1,Salvador María12,Santana‐Otero Antonio1,Veintemillas‐Verdaguer Sabino1,Beni Valerio3,Morales María del Puerto1ORCID

Affiliation:

1. Instituto de Ciencia de Materiales de Madrid (ICMM) Consejo Superior de Investigaciones Científicas (CSIC) C/ Sor Juana Inés de la Cruz 3 Madrid 28049 Spain

2. Department of Physics & IUTA Campus of Viesques University of Oviedo C/ Wifredo Ricart s/n Gijón 33203 Spain

3. RISE Research Institutes of Sweden Digital Systems, Smart Hardware, Printed Bio‐ and Organic Electronics RISE Södra Grytsgatan 4 Norrköping SE 60223 Sweden

Abstract

AbstractThe development of electronics with net zero carbon emissions through more efficient and environmentally friendly materials and processes is still a challenge. Here, alternative chemical synthesis routes of metal conductive nanoparticles, based on biodegradable materials are explored, such as nickel, iron–nickel alloy and iron nanoparticles, to be used, in the long term, as fillers in inks for inject printing. Thus, Ni and FeNi metal nanoparticles of 25–12 nm, forming aggregates of 614–574 nm, respectively, are synthesized in water in the presence of a polyol and a reducing agent and under microwave heating that enables a more uniform and fast heating. Iron nanoparticles of 120 ± 40 nm are synthesized in polyol that limits the aggregation and the oxidation degree. Commercial metal nanoparticles of iron and nickel, are coated with ethylene glycol and used for comparison. The conductivity of nanoparticles when pressed into pellets remains similar for both commercial and synthesized samples. However, when deposited on a strip line and heated, synthesized Ni, FeNi, and Fe nanoparticles show significant conductivity and interesting magnetic properties. It is demonstrated that the nanosize facilitates sintering at reduced temperatures and the capping agents prevent oxidation, resulting in promising conductive fillers for printed electronic applications.

Funder

Ministerio de Ciencia e Innovación

HORIZON EUROPE Framework Programme

Publisher

Wiley

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