Remarkable Reduction of Interfacial Thermal Resistance in Nanophononic Heterostructures-Reference-Cited by-同舟云学术

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Remarkable Reduction of Interfacial Thermal Resistance in Nanophononic Heterostructures

Published:2020-08-18 Issue:42 Volume:30 Page:2004003
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Ren Kai¹²,Liu Xiangjun³,Chen Shuai²,Cheng Yuan²,Tang Wencheng¹,Zhang Gang²^ORCID

Affiliation:

1. School of Mechanical Engineering Southeast University Nanjing Jiangsu 211189 China

2. Institute of High Performance Computing Agency for Science, Technology and Research (A*STAR) Singapore 138632 Singapore

3. Institute of Micro/Nano Electromechanical System College of Mechanical Engineering Donghua University Shanghai 201620 China

Funder

Agency for Science, Technology and Research

China Scholarship Council

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.202004003

Reference80 articles.

1. Thermal conduction phenomena in carbon nanotubes and related nanostructured materials

2. Colloquium: Phononics: Manipulating heat flow with electronic analogs and beyond

3. Size-dependent phononic thermal transport in low-dimensional nanomaterials

4. Length-dependent thermal conductivity in suspended single-layer graphene

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