Affiliation:
1. School of Naval Architecture and Maritime Zhejiang Ocean University Zhoushan Zhejiang 316022 China
2. State Key Laboratory of Silicon and Advanced Semiconductor Materials Zhejiang University Hangzhou 310027 China
3. Department of Advanced Manufacturing and Robotics College of Engineering Peking University Beijing 100871 China
4. Department of Mechanical and Materials Engineering Portland State University Portland OR 97201 USA
5. Key Laboratory of Ocean Energy Utilization and Energy Conversion of Ministry of Education School of Energy and Power Engineering Dalian University of Technology Dalian 116024 China
Abstract
AbstractThermal rectification devices, which facilitate preferential heat flow in a singular direction, stands as pivotal tools in the realization of solid‐state thermal circuits. 1D atomic chains, exhibit heightened thermal rectification efficiency owing to their exceptional directional heat conduction properties. These will find widespread utility in many applications, encompassing areas such as cooling, energy harvesting, and thermal isolation systems. However, unlike quasi‐1D materials, the intrinsic anisotropic heat transport in true‐1D atomic chains is yet to be systematically studied. Herein, the origins of the anisotropic heat transfer in three representative 1D structures (TaSe3 and BaTiS3 marked as quasi‐1D, MoI3 labeled as true‐1D) is first investigated by integrating a first‐principles density functional theory‐based framework of two‐channel heat conduction model. In contrast to quasi‐1D, MoI3 exhibits a giant anisotropy of lattice thermal conductivity (κL) in chain‐ and cross chain‐directions with a high ratio up to ≈20, which far exceeds the previous report for HfTe5 and ZrTe5. Such unique heat transfer reveals comprehensively by charge‐sharing and transferred charges, p‐‐d orbital hybridization and Young's modulus changes, induces an exceptionally large anisotropy. This study presents a high‐performance implementation of thermal rectification designed to regulate directional heat current, demonstrating its potential applicability in solid‐state thermal circuits.
Funder
National Natural Science Foundation of China