Electrically/Magnetically Dual‐Driven Shape Memory Composites Fabricated by Multi‐Material Magnetic Field‐Assisted 4D Printing

Author:

Wu Pan12,Yu Tianyu12ORCID,Chen Mingjun12,Kang Nan3,Mansori Mohamed El34

Affiliation:

1. State Key Laboratory of Robotics and System Harbin Institute of Technology Harbin Heilongjiang 150001 China

2. School of Mechatronics Engineering Harbin Institute of Technology Harbin Heilongjiang 150001 China

3. Arts et Metiers Institute of Technology MSMP HESAM Université Châlons‐en‐Champagne F‐51006 France

4. Texas A&M Engineering Experiment Station College Station TX 77843 USA

Abstract

AbstractShape memory polymers (SMPs) are smart materials that enable to transform back to their original shape from the deformed state when subjected to external stimuli. They have shown great potential used as sensors and actuators in diverse applications. However, current research on SMPs primarily focuses on the utilization of a single source of stimuli (e.g., electricity, magnetism, light, etc.), which heavily restricts their potential in complex circumstances. In this study, a novel approach is developed to fabricate multi‐layer electrically/magnetically dual‐driven shape memory composites (ML‐EMSMCs) based on a magnetic field‐assisted digital light processing (MF‐DLP) 4D printing technique. The fabricated ML‐EMSMCs contain alternating high electric conductive layers (up to 5.37 × 10−3 S cm−1) and magnetic responsive layers (10.7 emu g−1), enabling Joule heat‐based and high‐frequency magnetic field induction‐based stimuli. Furthermore, the ML‐EMSMCs exhibited excellent shape memory behavior, good formability, and magnetic properties. The developed 4D printing techniques allows for the alignment of magnetic particles with a unidirectional magnetic field, significantly improving their shape recovery speed. The developed electrically/magnetically dual‐driven and photocurable SMP composites shed light on the development of actuators and sensors with multiple functionalities.

Funder

Fundamental Research Funds for the Central Universities

Publisher

Wiley

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