Strongly Coupled NiMo@Alloy‐LDH Interfaces with Low‐Barrier Schottky Junctions for Oxygen Evolution Reaction

Author:

Yin Chaojie1,Zhou Fanghe1,Wu Jiang1ORCID,Zhang Xin1,Wen Jili2,Zhu Rui3,Ma Mei4,Yoriya Sorachon5,He Ping1,Fang Qi1,Wang Jiachao1,An Guangyang1

Affiliation:

1. College of Energy and Mechanical Engineering Shanghai University of Electric Power Shanghai 200090 China

2. Shanghai Institute of Special Equipment Inspection and Technical Research Shanghai 200062 China

3. College of Mathematics and Physics Shanghai University of Electric Power Shanghai 200090 China

4. Institute of Photochemistry and Photofunctional Materials University of Shanghai for Science and Technology Shanghai 200093 China

5. MTEC National Science and Technology Development Agency (NSTDA) 111 Thailand Science Park, Phahonyothin Road, Khlong Nueng, Khlong Luang Pathum Thani 12120 Thailand

Abstract

AbstractThe main challenge in developing Schottky‐contact OER catalytic devices based on layered double hydroxides (LDHs) is to achieve metal–semiconductor junctions with low contact resistance and high charge transfer capacity. However, due to the presence of high potential barriers and Fermi pinning, conventional Schottky contacts are usually unsatisfactory, resulting in poor‐working electrode performance and high energy consumption. In this study, a new concept of “hindrance factor” is introduced to quantify the difficulty of electron transfer, and a low‐hindrance factor Schottky contact formed by strong coupling of semiconductor LDH and NiMo alloy clusters is designed. This interface guides charge redistribution, optimizes the bonding and orbital states of adsorption sites, and enhances the targeted adsorption of OH intermediates. The results show that the configured NiMo@NiFeCe‐LDH working electrode only needs 1.445 V (vs RHE) to drive the reaction and shows excellent durability in 400 h of testing. At the same time, based on this study, a strategy for screening high‐performance Schottky junctions is developed. This strategy provides a bridge for studying interface properties, orbital hybridization, and charge transfer, reveals the potential mechanism for reducing contact resistance, and has important guiding significance for screening high‐performance metal–semiconductor electrocatalysts and stability.

Funder

National Natural Science Foundation of China

Key Technologies Research and Development Program

Publisher

Wiley

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