Hybrid network formation of silicon carbide and expanded graphene nanoplatelets in epoxy resin for thermal management

Abstract

AbstractThe current study discusses the incorporation of silicon carbide (SiC) and expanded graphene nanoplatelets (GNP) hybrid filler into epoxy resin to enhance its thermal conductivity, mechanical, and electrical insulation properties. The hybrid filler was incorporated into the epoxy resin by ultrasonic‐assisted blending solution process, and the thermal, electrical, and mechanical properties of the samples were assessed. The results displayed that both SiC and GNP fillers enhance the thermal conductivity of the epoxy resin. Addition of 15.3 wt% SiC/GNP filler (15/0.3) to pure epoxy increased the thermal conductivity coefficient by over 230%. The samples maintained the electrical insulation properties with electrical conductivity (EC) less than 10−9 S/m. Both fillers reduced the breakdown voltage of the samples. Furthermore, strong filler‐matrix adhesion resulted in a significant 414% improvement in Izod impact strength.Highlights Combining SiC and GNP fillers affects the thermal and electrical properties of epoxy. SiC and GNP synergistically improved the thermal diffusivity and conductivity of epoxy. The prepared composites remained in the range of electrical insulation. The impact strength of composites enhanced more than 400% compared to epoxy.