Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices-Reference-Cited by-同舟云学术

Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices

Published:2016-03-23 Issue:26 Volume:133 Page:
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Chiang Tzu Hsuan¹,Lin Ya-Chun¹,Chen Yi-Fu²,Chen Emi-Yun¹

Affiliation:

1. Department of Energy Engineering; National United University; 2, Lienda, Nan-Shi Li Miaoli Taiwan 36003 Republic of China

2. Specialty Alloy Development Section, New Materials R & D Department, China Steel Corporation; 1, Chung Kang Road, Hsiao Kang Kaohsiung Taiwan 81233 Republic of China

Funder

China Steel Corporation of Taiwan

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.43587/fullpdf

Reference30 articles.

1. Beaulieu , T. 2015 1

2. Comparison of epoxy resins for applications in light-emitting diodes

3. Vertical InGaN light-emitting diodes with Ag paste as bonding layer

4. New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages

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