1. LTCC application manual at www.dupont.com/mcm/gtapesys/index.html
2. and Modeling and experimental validation of interconnects with meshed power planes, Proc of 47th Electronic Components Technol Conf (1997), 1158-1162.
3. and Coupling behavior between transmission lines with meshed ground planes in LTCC-MCMs, Proc 11th Euro Microelectron Conf (1997), 92-99.
4. and Mesh-structured on-chip power/ground: Design for minimum inductance and characterization for fast R, L extraction, Proc IEEE Custom Integrated Circuits Conf (1999), 461-465.
5. Application of CFD technology to electronic thermal management