Enhanced thermal and mechanical properties of epoxy composites filled with hybrid filler system of aluminium nitride and boron nitride

Author:

Permal Anithambigai1,Devarajan Mutharasu1,Huong Ling Hung2,Zahner Thomas3,Lacey David2,Ibrahim Kamarulazizi1

Affiliation:

1. Nano Optoelectronics Research Laboratory, School of Physics; Universiti Sains Malaysia; Minden Penang 11800 Malaysia

2. OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd, Bayan Lepas Free Industrial Zone Phase 1; Bayan Lepas Penang 11900 Malaysia

3. OSRAM Opto Semiconductors GmbH, Leibnizstr.4; Regensburg 93055 Germany

Funder

USM for the Post Graduate Research Grant Scheme (PRGS)

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Reference53 articles.

1. Z. Guangchen F. Shiwei W. Lu X. Xuesong G. Lichao M. Haijie Solid-State and Integrated-Circuit Technology, ICSICT 2008. 9th International Conference 2008

2. P. Kohli M. Sobczak J. Bowin M. Matthews Electronic Components and Technology Conference, 51st Proceedings 2001

3. The thermal conductivity of Al(OH)3 covered MWCNT/epoxy terminated dimethyl polysiloxane composite based on analytical Al(OH)3 covered MWCNT

4. High thermal conductivity and high electrical resistivity of poly(vinylidene fluoride)/polystyrene blends by controlling the localization of hybrid fillers

5. Characterization of electrical and thermal properties of carbon nanotube/epoxy composites

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