Enhanced thermal and mechanical properties of epoxy composites filled with hybrid filler system of aluminium nitride and boron nitride-Reference-Cited by-同舟云学术

Enhanced thermal and mechanical properties of epoxy composites filled with hybrid filler system of aluminium nitride and boron nitride

Published:2017-01-09 Issue:S3 Volume:39 Page:E1372-E1380
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polym. Compos.

Author:

Permal Anithambigai¹,Devarajan Mutharasu¹,Huong Ling Hung²,Zahner Thomas³,Lacey David²,Ibrahim Kamarulazizi¹

Affiliation:

1. Nano Optoelectronics Research Laboratory, School of Physics; Universiti Sains Malaysia; Minden Penang 11800 Malaysia

2. OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd, Bayan Lepas Free Industrial Zone Phase 1; Bayan Lepas Penang 11900 Malaysia

3. OSRAM Opto Semiconductors GmbH, Leibnizstr.4; Regensburg 93055 Germany

Funder

USM for the Post Graduate Research Grant Scheme (PRGS)

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pc.24268/fullpdf

Reference53 articles.

1. Z. Guangchen F. Shiwei W. Lu X. Xuesong G. Lichao M. Haijie Solid-State and Integrated-Circuit Technology, ICSICT 2008. 9th International Conference 2008

2. P. Kohli M. Sobczak J. Bowin M. Matthews Electronic Components and Technology Conference, 51st Proceedings 2001

3. The thermal conductivity of Al(OH)3 covered MWCNT/epoxy terminated dimethyl polysiloxane composite based on analytical Al(OH)3 covered MWCNT

4. High thermal conductivity and high electrical resistivity of poly(vinylidene fluoride)/polystyrene blends by controlling the localization of hybrid fillers

5. Characterization of electrical and thermal properties of carbon nanotube/epoxy composites

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing thermal mechanical properties of polymer composites with hollow porous fillers;Composites Part A: Applied Science and Manufacturing;2024-04

2. Thermal analysis of sustainable and micro-filler Basalt reinforced polymer biocomposites for lightweight applications;Journal of Building Engineering;2023-11

3. Al ₂ O ₃ / h‐BN /epoxy based electronic packaging material with high thermal conductivity and flame retardancy;Journal of Applied Polymer Science;2022-11

4. Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging;Polymers;2022-07-21

5. Influences of Modified Sm2O3 on Thermal Stability, Mechanical and Neutron Shielding Properties of Aminophenol Trifunctional Epoxy Resin;Polymers;2022-02-08