Platinum–Copper Defects in Silicon-Reference-Cited by-同舟云学术

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Platinum–Copper Defects in Silicon

Published:2019-07-17 Issue:17 Volume:216 Page:1900311
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Phys. Status Solidi A

Author:

Kolkovsky Valery¹^ORCID,Kolkovsky Vladimir²,Weber Jörg¹

Affiliation:

1. Technische Universität Dresden 01062 Dresden Germany

2. Engineering DepartmentIPMS Fraunhofer Maria-Reiche Str.2 01109 Dresden Germany

Funder

Deutsche Forschungsgemeinschaft

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pssa.201900311

Reference23 articles.

1. Copper Metallization for High Performance Silicon Technology

2. Line Resistance Reduction in Advanced Copper Interconnects

3. Via Resistance Reduction in Advanced Copper Interconnects

4. The effect of platinum contact metallization on Cu/Sn bonding

5. Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder

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