Transmission electron microscopy study for investigating high-temperature reliability of Ti10 W90 -based and Ta-based diffusion barriers up to 600°C-Reference-Cited by-同舟云学术

Transmission electron microscopy study for investigating high-temperature reliability of Ti10 W90 -based and Ta-based diffusion barriers up to 600°C

Published:2015-12-03 Issue:4 Volume:213 Page:1055-1062
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Phys. Status Solidi A

Author:

Budhiman Nando¹,Schürmann Ulrich¹,Jensen Björn²,Chemnitz Steffen¹²,Kienle Lorenz¹,Wagner Bernhard¹²

Affiliation:

1. Institute of Material Science, Christian-Albrechts-Universität, Kaiserstr. 2, 24143 Kiel, Germany

2. Fraunhofer Institute for Silicon Technology, Fraunhoferstr. 1, 25524 Itzehoe, Germany

Funder

The Federal Ministry of Education and Research of Federal Republic of Germany

Federal Ministry of Education and Research

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pssa.201532654/fullpdf

Reference25 articles.

1. W. Welch K. Najafi 2007 1327 1328

2. N. Budhiman U. Schürmann B. Jensen S. Chemnitz L. Kienle B. Wagner 2015 169 174

3. D. B. Williams C. B. Carter 2009

4. Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2

5. Volume diffusion of Ytterbium in YAG: thin-film experiments and combined TEM–RBS analysis

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal shock resistance and toughening mechanism of W/Ta and W/TiN/Ta laminated composites;International Journal of Refractory Metals and Hard Materials;2022-06

2. Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis;Nanomaterials;2022-05-20