Author:
Gracias A.,Tokranova N.,Thelen B. C. M.,Castracane J.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. N. Magen A. Kolodny U. Weiser N. Shamir Proc. Int. Workshop on SLIP 2004 7
2. Wafer-level 3D integration technology
3. M. Koyanagi T. Fukushima T. Tanaka Proc. Asia and South Pacific Design Automation Conf. 4796515 2009 409
4. A wafer-scale 3-D circuit integration technology
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