SciFab -a wafer-level heterointegrated InP DHBT/SiGe BiCMOS foundry process for mm-wave applications

Author:

Weimann Nils G.1,Stoppel Dimitri1,Schukfeh Muhammed I.1,Hossain Maruf1,Al-Sawaf Thualfiqar1,Janke Bernd1,Doerner Ralf1,Sinha Siddharta1,Schmückle Franz-Josef1,Krüger Olaf1,Krozer Viktor1,Heinrich Wolfgang1,Lisker Marco2,Krüger Andreas2,Datsuk Anton2,Meliani Chafik2,Tillack Bernd23

Affiliation:

1. Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH), Gustav-Kirchhoff-Straße 4; 12489 Berlin Germany

2. IHP GmbH, Im Technologiepark 25; 15236 Frankfurt (Oder) Germany

3. TU Berlin, HFT4, Einsteinufer 25; 10587 Berlin Germany

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. B. Heinemann R. Barth D. Bolze J. Drews G. Fischer A. Fox O. Fursenko T. Grabolla U. Haak D. Knoll R. Kurps M. Lisker S. Marschmeyer H. Rücker D. Schmidt J. Schmidt M. Schubert B. Tillack C. Wipf D. Wolansky Y. Yamamoto f T / f max 2010 30.5.1 30.5.4

2. (Invited) Towards 0.7 Terahertz Silicon Germanium Heterojunction Bipolar Technology – The DOTSEVEN Project

3. First Demonstration of Amplification at 1 THz Using 25-nm InP High Electron Mobility Transistor Process

4. J. Hacker M. Urteaga M. Seo A. Skalare R. Lin 2013 1 3

5. An InGaAs/InP DHBT With Simultaneous $\text{f}_{\boldsymbol \tau }/\text{f}_{\text {max}}~404/901$ GHz and 4.3 V Breakdown Voltage

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