Scalable Thermal Masking Technique for Postprocessing of Flexible Electronics-Reference-Cited by-同舟云学术

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Scalable Thermal Masking Technique for Postprocessing of Flexible Electronics

Published:2021-08-12 Issue:12 Volume:23 Page:2100599
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv Eng Mater

Author:

Kashyap Varun¹^ORCID,Mosadegh Bobak¹,Dunham Simon¹^ORCID

Affiliation:

1. Dalio Institute for Cardiovascular Imaging Department of Radiology Weill Cornell Medicine New York NY 10021 USA

Funder

U.S. Army Medical Research Acquisition Activity

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202100599

Reference13 articles.

1. Multilayer fabrication of durable catheter-deployable soft robotic sensor arrays for efficient left atrial mapping

2. Inorganic Semiconductors for Flexible Electronics

3. Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

4. Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes

5. The Power of Direct Writing

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Creating Stretchable Electronics from Dual Layer Flex-PCB for Soft Robotic Cardiac Mapping Catheters;Micromachines;2023-04-20

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