High‐Resolution 3D Deposition of Electrospun Fibers on Patterned Dielectric Elastomers

Author:

Doan My-Anh1,Tobos Carmen I.1ORCID,Creighton Rachel L.1,Guo Teri1,Faber Kate A.1,Han Youngshang2,Chiew Cerwyn2,Hull Ian T.1ORCID,Malakooti Mohammad H.2,Woodrow Kim A.1ORCID

Affiliation:

1. Department of Bioengineering University of Washington 3720 15th Ave NE Seattle WA 98195 USA

2. Department of Mechanical Engineering Institute for Nano-Engineered Systems University of Washington 3900 E Stevens Way NE Seattle WA 98195 USA

Abstract

Electrostatic patterning has improved the performance of devices incorporating electrospun fibers in a wide variety of applications. However, the impact of process parameters on the final fiber pattern in these systems is rarely analyzed. Herein, a systematic analytical approach is developed to define quantitative metrics related to fiber patterning. Three‐dimensional patterned dielectric elastomer collectors are fabricated via solution‐casting polydimethylsiloxane with embedded carbon black or liquid metal droplets. Fiber patterning metrics are used to evaluate the effect of collector parameters such as insulating layer thickness, electrical ground surface area, and three‐dimensional pattern geometry. Dielectric layer parameters such as conductive material concentration and particle diameter are also investigated. Using this framework, the best‐performing collector is shown to improve selectivity 30‐fold, uniformity ninefold, reproducibility eightfold, and increase fiber volume by one order of magnitude. Furthermore, eutectic gallium indium liquid metal and scaled‐up pattern geometries demonstrate the tunability of this approach and broad applicability of systematic fiber pattern analysis. This rational approach to patterned fiber development can be applied to virtually any method or pattern to better understand the fiber patterning processes.

Funder

National Institute of Dental and Craniofacial Research

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

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