A Low‐Binder‐Content Ink System for 3D Printing High‐Density and Small Feature Size 316L Stainless Steel Parts

Author:

Guo Hao1,Qin Jing2,Zhou Shiyu2,Qian Bo1ORCID,Li Lingying1,Zhu Dezhi3,Shi Xuejun4

Affiliation:

1. Key Laboratory of Multifunctional Nanomaterials and Smart Systems Suzhou Institute of Nano-Tech and Nano-Bionics Chinese Academy of Sciences Suzhou 215123 China

2. School of Nano Technology and Nano Bionics University of Science and Technology of China Suzhou 215123 China

3. Guangdong Key Laboratory for Advanced Metallic Materials Processing School of Mechanical and Automotive Engineering South China University of Technology Guangzhou 510640 China

4. School of Physical Science and Technology Soochow University Suzhou 215006 China

Abstract

Binder ink system is the backbone of binder jet 3D printing (BJ‐3DP) technology. Compared with metal injection molding (MIM), BJ‐3DP needs much less amount of binder, which means less exhaust gas generation during the debinding process and more environmental friendliness. More than that, low content of binder is also supposed to benefit the structure properties of the printed metal parts. Herein, an ultralow‐binder‐content ethanol–water–PVP ink system is demonstrated for the BJ‐3DP 316 L stainless steel parts by applying thermal bubble inkjet technology. The PVP binder concentration is as low as 80 mg mL−1, which can achieve an ultralow solid content of 0.2 wt% in the printed green part. The two‐component solution with water and ethanol provides not only the rheology property adjustment freedom for the ink jetting and infiltration in the metal powders, but also the two boiling points for the step‐by‐step capillary bridge formation process. By applying the low‐binder‐content ink, the fully densified 316 L stainless steel parts after sintering can obtain the relative density up to 99.4%, Vickers hardness up to 185 HV, tensile strength up to 542 MPa, 25% elongation at break, and feature size as small as 200 μm.

Funder

National Natural Science Foundation of China

Science and Technology Program of Suzhou

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

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