Time‐Resolved Evolution of the 3D Nanoporous Structure of Sintered Ag by X‐Ray Nanotomography: Role of the Interface with a Copper Substrate-Reference-Cited by-同舟云学术

Time‐Resolved Evolution of the 3D Nanoporous Structure of Sintered Ag by X‐Ray Nanotomography: Role of the Interface with a Copper Substrate

Published:2021-10-26 Issue:1 Volume:24 Page:2100583
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv Eng Mater

Author:

N’Tsouaglo Kokouvi Happy¹,Milhet Xavier¹^ORCID,Colin Jérôme¹,Signor Loic¹,Nait-Ali Azdine¹,Creus Juan²,Gueguen Mikael¹,Gadaud Pascal¹,Legros Marc³

Affiliation:

1. Department Physics and Mechanics of Materials Institut Pprime—UPR CNRS 3346 ENSMA—Université de Poitiers 1 avenue Clément Ader Chasseneuil-Futuroscope 86961 France

2. LASIE—UMR CNRS 7356 Pôle Sciences et Technologie Université de La Rochelle Avenue Michel Crépeau La Rochelle 17042 France

3. CEMES—CNRS Institut de Physique 29 rue Jeanne Marvig Toulouse cedex 4 31055 France

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202100583

Reference63 articles.

1. Comparison of 6H-SiC, 3C-SiC, and Si for power devices

2. State of the art of high temperature power electronics

3. Power electronics packaging

4. Performance, Reliability, and Robustness of 4H-SiC Power DMOSFETs

5. Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography;Materials & Design;2024-08

2. Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging;Materials & Design;2024-04

3. A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids;Journal of Electronic Materials;2024-03-08

4. Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles;Materials Letters;2023-10

5. Experimental investigation of thermal conductivity during aging of nanoporous sintered silver;Acta Materialia;2023-09