Additive Manufacturing of High‐Temperature Preceramic‐Derived SiOC Hybrid Functional Ceramics

Abstract

High‐temperature capable materials, metals, and ceramics are attracting significant interest for applications in extreme environmental conditions. Herein, a hybrid metal‐reinforced ceramic matrix material consisting of preceramic‐derived high‐temperature SiOC and copper nanoplates is reported, enabling the manufacturing of high‐temperature sensing electronics. The preceramic polymer precursors including polydimethylsiloxane and polydimethylsilane, together with copper nanoplates, are thermally converted into durable copper‐reinforced SiOC ceramics. The presence of copper in SiOC ceramics enhances its electrical conductivity, while SiOC suppresses oxygen uptake and acts as a shield for oxidation to achieve high‐temperature thermal resistance and negative temperature coefficient at high temperatures. A comprehensive electric and sensing performance, combined with cost‐effectiveness and scalability, can facilitate the utilization of hybrid Cu and SiOC composites in high‐temperature electronics.