Laser Powder Bed Fusion of Cu–Al–Ni–Mn Shape‐Memory Alloy for the Application of Active Heat Sinks: Processability, Microstructures, and Shape‐Memory Effect
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Published:2023-11-23
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Volume:
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ISSN:1438-1656
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Container-title:Advanced Engineering Materials
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language:en
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Short-container-title:Adv Eng Mater
Author:
Lin Kaijie12,
Tian Haodong12,
Gu Dongdong12ORCID,
Wang Chaochao12,
Yuan Luhao12,
Sun Jianfeng12
Affiliation:
1. College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Yudao Street 29 Nanjing 210016 China
2. Jiangsu Provincial Research Center for Laser Additive Manufacturing of High-Performance Components Nanjing University of Aeronautics and Astronautics Yudao Street 29 Nanjing 210016 China
Abstract
Cu‐based shape‐memory alloys (Cu‐based SMAs) demonstrate prospects in active heat sinks due to their excellent thermal conductivity, high transformation temperature, and low cost. However, their inferior mechanical properties have hindered their industrial application. Previous studies have indicated that mechanical properties can be improved by decreasing grain size and minimizing microstructural segregation, which can be achieved by laser powder bed fusion (LPBF) process. This work investigates the influence of process parameters on the processability, microstructure, and shape‐memory effect (SME) of 81.95Cu–11.85Al–3.2Ni–3Mn (wt%) thin‐walled samples fabricated by LPBF. Results reveal that laser power and scanning speed significantly affect the relative density of the Cu‐based SMA thin‐walled samples, and higher laser power and scanning speed contribute to better processability. Additionally, the high cooling rate during the LPBF process facilitates the formation of β1′ martensite without requiring posttreatment, and the size of the β1′ martensite decreases with increasing scanning speed. In bending‐recovery experiments, specimens fabricated at higher scanning speed exhibit the highest SME recovery rate and bending angle. Moreover, the test confirms that Cu‐based SMA formed at lower scanning speeds exhibits even higher thermal conductivity. This work shows the potential of fabricating high‐performance Cu‐based SMA components by LPBF.
Funder
Key Technologies Research and Development Program
National Outstanding Youth Foundation of China
NSAF Joint Fund
Jiangsu Provincial Key Research and Development Program
Innovative Research Group Project of the National Natural Science Foundation of China
Six Talent Peaks Project in Jiangsu Province
Subject
Condensed Matter Physics,General Materials Science
Cited by
1 articles.
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