Dissolution of copper oxide by the ethanolamine and ammonium fluoride in aqueous solution
Author:
Publisher
Wiley
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/sia.3777/fullpdf
Reference17 articles.
1. Direct Resist Removal Process from Copper-Exposed Vias for Low-Parasitic-Capacitance Interconnects
2. Corrosion Behavior of Copper Thin Films in Organic HF-Containing Cleaning Solution for Semiconductor Applications
3. Materials' Impact on Interconnect Process Technology and Reliability
4. Effects of Amine Fluoride Cleaning Chemistry on Metallic Aluminum Integrated Circuit Films
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1. Dissolution of copper and copper oxide in aqueous solution containing amine or carboxylic acid;Korean Journal of Chemical Engineering;2022-07-22
2. Cleaning Behavior of Aqueous Solution Containing Amine or Carboxylic Acid in Cu-interconnection Process;KOREAN CHEM ENG RES;2021
3. Alkanolamines as activators in no-clean flux systems: investigation of humidity robustness and solderability;Journal of Materials Science: Materials in Electronics;2021-01-20
4. Characteristics of Semi-Aqueous Cleaning Solution with Carboxylic Acid for the Removal of Copper Oxides Residues;Korean Chemical Engineering Research;2016-08-01
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