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Kron-Branin modeling of symmetric star tree interconnect

  • Published:2018-10-15 Issue:3 Volume:47 Page:391-405
  • ISSN:0098-9886
  • Container-title:International Journal of Circuit Theory and Applications
  • language:en
  • Short-container-title:Int J Circ Theor Appl

Author:

Xu Zhifei1,Ravelo Blaise1ORCID,Maurice Olivier2,Lalléchère Sébastien3,Wan Fayu4

Affiliation:

1. Normandy University UNIROUEN, ESIGELEC, IRSEEM; Rouen France

2. Ariane Group, Route de Verneuil; Les Mureaux France

3. Université Clermont Auvergne, CNRS, SIGMA Clermont, Institut Pascal; Aubière France

4. Nanjing University of Information Science & Technology; Nanjing China

Funder

Conseil Régional de Haute Normandie

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Science Applications,Electronic, Optical and Magnetic Materials

Reference51 articles.

1. International technology roadmap for semiconductors (ITRS) reports 2015 http://www.itrs2.net/itrs-reports.html

2. Technology and reliability constrained future copper interconnects-part II: performance implications;Kapur;IEEE Trans Electron Devices,2002

3. Husby H High density interconnect http://www.datarespons.com/high-density-interconnect/

4. Advantages and challenges of 10-Gbps transmission on high-density interconnect boards;Yee;J Electron Mater,2016

5. Shaughnessy A Holden H Las Marias S Three perspectives on HDI design and manufacturing success 2017 22 27

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