Analysis of PHM Patents for Electronics-Reference-Cited by-同舟云学术

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Analysis of PHM Patents for Electronics

Published:2018-08-24 Issue: Volume: Page:613-647
ISSN:
Container-title:Prognostics and Health Management of Electronics
language:
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Author:

Liu Zhenbao¹,Jia Zhen²,Vong Chi-Man³,Bu Shuhui¹,Pecht Michael G.⁴

Affiliation:

1. Northwestern Polytechnical University; School of Aeronautics; Xi'an China

2. Northwestern Polytechnical University; Means of Transport Applied Engineering; Xi'an China

3. University of Macau; Department of Computer and Information Science; Macau China

4. University of Maryland; Center for Advanced Life Cycle Engineering; College Park MD USA

Publisher

John Wiley and Sons Ltd

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119515326.ch22/fullpdf

Reference159 articles.

1. Heutel , K. Vetter , R. 1988 Problem notification: Tin whisker growth in electronic assemblies. GIDEP Alert F3-A-87-04A

2. Corbid , L. 1989 Constraints on the use of tin plate in miniature electronic circuits Proceedings of the 3rd International SAMPE Electronics Materials and Process Conference

3. Richardson , J. H. Lasley , B. R. 1992 Tin whisker initiated vacuum metal arcing in spacecraft electronics. Proceedings of the Government Microcircuit Applications Conference, November, 119-122, Las Vegas, NV

4. Nordwall , B. 1986 Air force links radar problems to growth of tin whiskers, Aviation Week. Sp. Technol., June, 65-70

5. Tin whisker growth from electroplated finished-a review;Bunyan;International Journal of Surface Engineering and Coatings,2013

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