Antenna Integration in Packaging Technology operating from 60 GHz up to 300 GHz (HDI‐based AiP)-Reference-Cited by-同舟云学术

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Antenna Integration in Packaging Technology operating from 60 GHz up to 300 GHz (HDI‐based AiP)

Published:2020-03-06 Issue: Volume: Page:179-218
ISSN:
Container-title:Antenna‐in‐Package Technology and Applications
language:
Short-container-title:

Author:

Gianesello Frédéric,Titz Diane,Luxey Cyril

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781119556671.ch7

Reference30 articles.

1. Advances in embedded traces for 1.5 μm RDL on 2.5D glass interposers;Liu F.;IEEE 65th Electronic Components and Technology Conference,2015

2. Microstrip antenna aperture-coupled to a microstripline

3. Radiation-pattern improvement of patch antennas on a large-size substrate using a compact soft-surface structure and its realization on LTCC multilayer technology

4. HDI organic technology integrating built‐in antennas dedicated to 60 GHz SiP solution;Pilard R.;IEEE International Symposium on Antennas and Propagation,2012

5. Development of a Millimeter-Wave Measurement Setup and Dedicated Techniques to Characterize the Matching and Radiation Performance of Probe-Fed Antennas [Measurements Corner]

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1. Millimeter-Wave Beam-Tilted Phased Array Antenna for 5G-Enabled IoT Devices;IEEE Internet of Things Journal;2024-01-01

2. Design of 77GHz Automotive Radar Antenna Based on FOWLP;2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA);2021-11-24

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