The effects of residual polymerization solvent on the physical properties of poly(2-cyano-p-phenylene terephthalamide)-Reference-Cited by-同舟云学术

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The effects of residual polymerization solvent on the physical properties of poly(2-cyano-p-phenylene terephthalamide)

Published:2016-04-08 Issue:28 Volume:133 Page:
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Jung Dae Eon¹,Kim Dong Jun¹,Eom Youngho¹,Lee Jaeyoung²,Kim Byoung Chul¹

Affiliation:

1. Department of Organic and Nano Engineering; Hanyang University; Seoul Korea 04763

2. Fundamental Technology R&D Group; Central Research Park, Kolon Industries, Inc.; Gumi Korea 446-797

Funder

Industrial Strategic Technology Development Program

Development of para-Aramid Fibers Spinnable in Organic Solvent)

Ministry of Trade, Industry and Energy (MOTIE) of Korea

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference25 articles.

1. Study on the thermal degradation of high performance fibers by TG/FTIR and Py-GC/MS

2. Thermal Characteristics of Para-Aramid Fibres

3. Mechanical behaviors of Kevlar 49 fabric subjected to uniaxial, biaxial tension and in-plane large shear deformation

4. Rheology and Physical Properties of Polysulfone in-situ Reinforced with a Thermotropic Liquid-Crystalline Polyester

5. Liquid crystal main-chain polymers for high-performance fibre applications

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Rheological and morphological evidence of binary liquid crystalline phases in solutions of an organo-soluble cyano-substituted p-aramid;Polymer;2022-11

2. Enthalpy-Driven Transition of Liquid Crystalline Textures of Poly(2-cyano-p-phenylene terephthalamide) in N,N-Dimethyl Acetamide/Lithium Chloride;Macromolecular Research;2019-02-26

3. Preparation and Properties of Soluble, Thermally Stable Poly(Silyl ether amide)s and Related Silica Nanocomposites;Polymer-Plastics Technology and Engineering;2016-12-20

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