Extraction of device S-parameters within board by using a TRL de-embedding technique-Reference-Cited by-同舟云学术

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Extraction of device S-parameters within board by using a TRL de-embedding technique

Published:2018-10-19 Issue:11 Volume:60 Page:2647-2651
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw Opt Technol Lett

Author:

Hamze Kassem¹²^ORCID,Pasquet Daniel²,Descamps Philippe²,De Ledinghen Edouard¹

Affiliation:

1. Normandie Université ENSICAEN/CRISMAT/UMR6508; Caen France

2. Presto Engineering Europe; France

Funder

Presto Engineering

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/mop.31473/fullpdf

Reference14 articles.

1. De-embedding a device-under-test (DUT) using thru measurements;Ong;Elect Perform Elect Packaging,2003

2. Liu Y Tian Y Gao B Tong L

3. Moon S Ye X Smith R IEEE Symposium on Electromagnetic Compatibility and Signal Integrity

4. Fledell E Grossman B th

5. Kwark YH Kotez M Baks C Gu X Schuster C IEEE MTT-S International Microwave Symposium

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Asymmetrical De-Embedding Method for Millimeter-Wave On-Wafer Measurement;2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI);2023-08-09

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