Voltammetric studies of dendrimer multilayers: Layer-by-layer assembly of metal-peptide dendrimers multilayers
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.28980/fullpdf
Reference94 articles.
1. Multilayers of colloidal particles
2. Buildup of ultrathin multilayer films by a self-assembly process, 1 consecutive adsorption of anionic and cationic bipolar amphiphiles on charged surfaces
3. Fuzzy Nanoassemblies: Toward Layered Polymeric Multicomposites
4. Electrostatic Layer-by-Layer Assembly of Poly(amido amine) Dendrimer/Conducting Sulfonated Polyaniline: Structure and Properties of Multilayer Films
5. Charge transport effects in ferrocene–streptavidin multilayers immobilized on electrode surfaces
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