P‐10.5: Study on The effect of Module Films on Metal Wire Strain During the Pad bending Process

Author:

Fu Jia1,Feng Shi Zhen1,Fan Liu Bin1,Shan Qi1,Huang Genmao1,Zhu Xiujian2,Wang Xiangqian1,Liu Shi Bao1,Liu Ying1,Chu Xiaotian1,Zhao Dong1

Affiliation:

1. New Industry Park Yungu (Gu'an) Technology Co., Ltd. Gu'an China

2. Kunshan Govisionox Optoelectronics Co., Ltd Kunshan China

Abstract

Based on ABAQUS mechanical simulation software and the same bending radius, this paper simulated and analyzed the strain change trends of metal wires on the different schemes for other key influencing films, such as BPL and PI. On the basis of the simulation results, the conclusions are follows: PI thickness thinning can decrease the strain of the metal wires at bending region. However, the change of BPL thickness has no significant effect.

Publisher

Wiley

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