Photo and Thermal Cured Silicon-Containing Diethynylbenzene Fibers via Melt Electrospinning with Enhanced Thermal Stability-Reference-Cited by-同舟云学术

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Photo and Thermal Cured Silicon-Containing Diethynylbenzene Fibers via Melt Electrospinning with Enhanced Thermal Stability

Published:2017-07-18 Issue:17 Volume:55 Page:2815-2823
ISSN:0887-624X
Container-title:Journal of Polymer Science Part A: Polymer Chemistry
language:en
Short-container-title:J. Polym. Sci. Part A: Polym. Chem.

Author:

Li Zhefu¹,Yuan Yichun¹,Chen Binling¹²,Liu Yong¹^ORCID,Nie Jun¹,Ma Guiping¹^ORCID

Affiliation:

1. State Key Laboratory of Chemical Resource Engineering; Beijing University of Chemical Technology; Beijing 100029 People's Republic of China

2. College of Engineering, Mathematics and Physical Sciences; University of Exeter; Exeter EX4 4QF United Kingdom

Publisher

Wiley

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pola.28687/fullpdf

Reference30 articles.

1. One-Dimensional Electrical Contact to a Two-Dimensional Material

2. Poly (lactic acid)-based biomaterials for orthopaedic regenerative engineering

3. A Controlled Design of Ripple-Like Polyamide-6 Nanofiber/Nets Membrane for High-Efficiency Air Filter

4. Superhydrophilic and underwater superoleophobic nanofibrous membrane with hierarchical structured skin for effective oil-in-water emulsion separation

5. Tailoring Supramolecular Nanofibers for Air Filtration Applications

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