Author:
Leong Timothy G.,Benson Bryan R.,Call Emma K.,Gracias David H.
Subject
Biomaterials,Biotechnology,General Materials Science,General Chemistry
Reference28 articles.
1. Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing
2. Finer features for functional microdevices
3. A path: from electroplating through lithographic masks in electronics to LIGA in MEMS
4. L. Weber, W. Ehrfeld, H. Freimuth, M. Lacher, H. Lehr, B. Pech, presented at Micromachining and Microfabrication Process Technology II, Austin, TX, USA, October 1996.
5. Self-Assembly at All Scales
Cited by
99 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献